Science Fair Project Encyclopedia
Die preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing . The process of die preparation typically consists of 2 steps: wafer mounting and die cutting.
The picture below shows a wafer after die preparation. A large number of dies were already removed.
10-26-2009 08:16:03
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The contents of this article is licensed from www.wikipedia.org under the GNU Free Documentation License. Click here to see the transparent copy and copyright details


