In electronics, a Dual In-line Package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and a row of electrical connecting pins along each of two opposite sides, usually the longer sides of the rectangle.

DIPs may be used for integrated circuits ("chips"), like microprocessors, or for discrete components such as resistors or toggle switches. A typical DIP may be a microcircuit package with two rows of seven vertical leads that is specially designed for mounting on a printed circuit board.

JEDEC-standard DIPs have the inter-lead spacing specified as 0.1" (2.54 mm) and the row spacing is specified at 0.3" (7.62 mm).

Several DIP variants exist, mostly distinguished by packaging material:

• Ceramic Dual In-line Package (CERDIP)
• Plastic Dual In-line Package (PDIP)
• Shrink Plastic Dual In-line Package (SPDIP) – A shrink version of the PDIP with a 0.07" (1.778 mm) lead pitch

Sources

• Federal Standard 1037C
• Intel (1996 databook). Packaging. ISBN 1-55512-254-X.