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Flip-chip pin grid array
Flip Chip Pin Grid Array - (FC-PGA) The package of certain Intel Celeron, Pentium III, and Pentium 4 processors. FC-PGA processors fit into Socket 370 or Socket 478 motherboard sockets.
The Flip Chip Pin Grid Array is similar to PPGA, except that the silicon core is facing up and the heat slug is exposed.
FC-PGA packaging is used by Pentium III processors, and Celeron 566 processors onward. Earlier Celeron processors used PPGA packaging.
A revision to the Flip Chip Pin Grid Array, FC-PGA2, adds a head spreader over the silicon core. It is used on late Pentium III processors and most Pentium 4 and Celeron processors using Socket 478. The FC-PGA2 packaging has been replaced by the land grid array (LGA775) packaging on Prescott-based Pentium 4 and Celeron D processors.
Celeron processors are also available in Slot 1 SEPP. Pentium III processors are also avaliable in Slot 1 SECC2 packaging. Pentium 4 processors are also avalible in Socket 423 Organic Land Grid Array (OGLA) on Interposer (OOI) (INT2 and INT3 ) and Socket T LGA775 packaging.
Adapters are available to allow a PPGA Celeron to plug into a Slot 1 connector.
See also pin grid array
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