Science Fair Project Encyclopedia
Integrated circuit packaging
(Redirected from IC packaging)
Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing .
In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Also, sometimes it is called encapsulation, by the name of its last step.
The following operations are performed at this stage.
- Die attaching
- IC Bonding
- Wire bonding
- Flip chip
- Tab bonding
- IC encapsulation
10-26-2009 08:16:03
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The contents of this article is licensed from www.wikipedia.org under the GNU Free Documentation License. Click here to see the transparent copy and copyright details