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Wet etching
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Wet etching is the removal of material by immersing the wafer in a liquid bath of chemical etchant. There are two kinds of wet etching etchants, isotropic etchants and anisotropic etchants:
- Isotropic etchants attack the material being etched at the same rate in all directions.
- Anisotropic etchants attack the silicon wafer at different rates in different directions. On wafers the most used etchant is KOH.
Last updated: 08-31-2005 08:29:00
10-26-2009 08:16:03
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The contents of this article is licensed from www.wikipedia.org under the GNU Free Documentation License. Click here to see the transparent copy and copyright details